Intel Opens Advanced EMIB-T Packaging to External Wafers
Feb 19, 2026 (21 hr ago)
Positive
Intel expands its advanced EMIB-T packaging services to accept wafers from external foundries, broadening its appeal for complex chip designs.
Advanced Packaging Strategy Shift
- Intel is opening EMIB-T packaging to wafers originating from other foundries, potentially pulling in accelerator and networking programs1
- Investors should monitor EMIB-T order flow and hyperscaler ASIC disclosures as key operational indicators1
- Ibiden plans a ¥500 billion investment to expand advanced capacity supporting complex multi-die packages, providing a direct tailwind for Intel's packaging customers1
Foundry Roadmap Execution and AI Investment
- Intel signaled confidence in its 18A supply readiness while highlighting momentum around next-generation client platforms1
- Key upcoming product launches, including Panther Lake client processors and Xeon 6+ server chips, are both built upon the 18A process node2
- The company announced a $100 million investment in SambaNova Systems as part of its strategy to strengthen its position in enterprise AI solutions2
Strategic Ecosystem Validation and Support
- Nvidia has opened a new stake in Intel as part of its recent portfolio adjustments and strategic realignments3
- Intel's foundry ambitions are receiving strategic backing through CHIPS Act incentives aimed at boosting domestic semiconductor production2
- The company maintains a strategic relationship with NVIDIA, collaborating specifically on manufacturing processes and ecosystem interoperability2
Emerging Technology Exploration
- G
Nvidia Exits Arm Stake
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